AMD Ryzen 7000 CPU Delidding Reveals IHS & Zen 4 CCD Gold Plated With High Quality TEAM
The removed CPU is part of the Ryzen 9 family as it has two prints and we know that the two CCD configurations only apply to the Ryzen 9 7950X & Ryzen 9 7900X. The chip has a total of three prints, two of which are the aforementioned AMD Zen 4 CCD which is made on the 5nm process node and then we have the larger print around the center which is the IOD and which is based on the 6nm process node. The AMD Ryzen 7000 CCD has a die size of 70mm2 compared to 83mm2 for the Zen 3 and features a total of 6.57 Billion transistors, a 58% increase over the Zen 3 CCD’s 4.15 Billion transistors,
Scattered around the package are a few SMDs (capacitors/resistors) which are usually under the substrate of the package if we consider Intel CPUs. AMD instead featured them on the top layer and because of that, they had to design a new type of IHS internally referred to as Octopus. We have have seen IHS delidded before but now we can see the final production chip without the cover to cover those gold Zen 4 nuggets!
As such, IHS is an interesting component of the AMD Ryzen 7000 Desktop CPU. One image shows the 8-arm array that Robert Hallock The ‘Technical Marketing Director at AMD’ is referred to as ‘Octopus’. Each arm has a small TIM application underneath which is used to solder the IHS to the interposer. Now removing the chip is going to be very difficult because each arm is right next to a huge array of capacitors. Each Arm is also slightly raised to make room for the SMD and users don’t have to worry about heat being trapped underneath.
AMD Ryzen 7000 Delidded Desktop CPU (Image Credit: GamersNexus):
Der8auer has also provided a statement to Gamers Nexus regarding an upcoming delidding kit for the AMD Ryzen 7000 Desktop CPU in the works and he also seems to explain why the new CPU features a gold-plated CCD:
Regarding gold plating, there is an aspect that you can solder indium to gold without the need for flux. This makes the process easier and you don’t need aggressive chemicals on your CPU. Without a gold layer, it would theoretically also work to solder silicon to copper, but it would be more difficult and you would need flux to break the oxide layer.
Der8auer to GamersNexus
The most interesting part of the AMD Ryzen 7000 Desktop CPU IHS, apart from the sleeve, is the gold plated IHS which is used to improve heat dissipation from the CPU/IO off and directly to the IHS. The two 5nm Zen 4 CCD and 6nm IO single die have TIM liquid-metal or thermal interface material for better heat conductivity and the aforementioned gold plating helps greatly in heat dissipation. What remains to be seen is whether the capacitor will feature a silicon coating or not, but from the previous package images, it looks like it does.
It’s also reported that IHS’s smaller surface area means it will be more compatible with existing coolers with both round and square cold plates. A square cold plate would be the preferred choice but a round one would work well too. Noctua has also shown TIM application method and they recommend users use the single dot pattern in the middle of the IHS for AMD AM5 CPUs.
AMD Ryzen 7000 Desktop CPU Renders (With/Without IHS):
Another thing to note is that every Zen 4 CCD is very close to the IHS edge which wasn’t necessarily the case with previous Zen CPUs. So not only will delidding be very difficult but the center is mostly IO die which means that the cooling equipment must be ready for the chip. AMD Ryzen 7000 Desktop CPUs launch in Fall 2022 on the AM5 platform. It’s a chip that can reach up to 5.85GHz with until Package power 230W so every bit of cooling will be a must for overclockers and enthusiasts alike.
Mainstream AMD Desktop CPU Generation Comparison:
|AMD CPU family||Codename||Processor Process||Processor Core/Thread (Max)||TDP (Max)||Platforms||Platform Chipsets||Memory Support||PCIe Support||Launch|
|Ryzen 1000||Peak Ridge||14nm (Zen 1)||8/16||95W||AM4||300-Series||DDR4-2677||Gen 3.0||2017|
|Ryzen 2000||Peak Ridge||12nm (Zen+)||8/16||105W||AM4||400-Series||DDR4-2933||Gen 3.0||2018|
|Ryzen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500-Series||DDR4-3200||Generation 4.0||2019|
|Ryzen 5000||Vermeer||7nm (Zen 3)||16/32||105W||AM4||500-Series||DDR4-3200||Generation 4.0||2020|
|Ryzen 5000 3D||Warhol?||7nm (3D Zen)||8/16||105W||AM4||500-Series||DDR4-3200||Generation 4.0||2022|
|Ryzen 7000||Rafael||5nm (Zen 4)||16/32||170W||AM5||600 . series||DDR5-5200||Gen 5.0||2022|
|Ryzen 7000 3D||Rafael||5nm (Zen 4)||16/32?||105-170W||AM5||600 . series||DDR5-5200/5600?||Gen 5.0||2023|
|Ryzen 8000||granite ridge||3nm (Zen 5)?||TBA||TBA||AM5||700-Series?||DDR5-5600+||Gen 5.0||2024-2025?|